Sun Chemical and DIC are presenting SunLam, the new range of lamination adhesives, serving the most demanding flexible packaging applications.
A family of high-performance adhesives for lamination was presented by Sun Chemical at Interpack. It is called SunLam and is the result of a technology initially developed by the parent company DIC with the aim of offering the demanding Asian market products with optimal performance even in difficult working conditions and in the case of delicate food products.
Top brand companies in fact express the need for flexible packaging capable of replacing traditional rigid applications. These solutions have to of course maintain or even improve the barrier properties of the previous structure, in order to safeguard the lifespan and integrity of the product.
The SunLam adhesives fully respond to these needs. In particular, they contribute significantly to resistance and the stability of the packaging to high temperatures; In addition, this new technology with oxygen barrier helps reduce the weight, cost and complexity of the pack, without compromising overall performance.
The SunLam family includes water-based, solvent-based and solventless products, designed to meet the needs of the main flexible packaging applications worldwide.
Sun Chemical is a member of the DIC group, the largest global producer of printing inks and pigments, supplier of pigments and a leading supplier of materials for packaging, publishing, coatings, plastics, cosmetics and other industrial markets. With annual sales of more than 3.5 billion dollars, Sun Chemical has over 8,000 employees operating worldwide.
